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IC Package Designer

Advance Package Design · Karachi

Junior 🇬🇧 English
Cadence APD Signal Integrity Power Integrity WLCSP layout

Job description

About the role

We are seeking a recent graduate in Electronics or IC Packaging to join our engineering team in Karachi. The position focuses on designing advanced integrated circuit packages and ensuring they are manufacturable through co‑design workflows.

Key responsibilities

  • Design advanced IC packages.
  • Optimize BGA and WLCSP layouts.
  • Implement co‑design workflows to guarantee manufacturability.

Required profile

  • Strong proficiency in Cadence APD or equivalent EDA tools.
  • Understanding of Signal Integrity (SI) and Power Integrity (PI) analysis.
  • Experience with IC package design.
  • Ability to optimize BGA and WLCSP layouts.
  • Focus on manufacturability in design processes.

Required skills

  • Cadence APD (or equivalent EDA software).
  • Signal Integrity analysis.
  • Power Integrity analysis.
  • BGA layout optimization.
  • WLCSP layout optimization.

Questions fréquentes

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Published 3 weeks ago

Expires 1 month from now

39 views · 0 interested

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Advance Package Design

Karachi