IC Package Designer
Advance Package Design · Karachi
Job description
About the role
We are seeking a recent graduate in Electronics or IC Packaging to join our engineering team in Karachi. The position focuses on designing advanced integrated circuit packages and ensuring they are manufacturable through co‑design workflows.
Key responsibilities
- Design advanced IC packages.
- Optimize BGA and WLCSP layouts.
- Implement co‑design workflows to guarantee manufacturability.
Required profile
- Strong proficiency in Cadence APD or equivalent EDA tools.
- Understanding of Signal Integrity (SI) and Power Integrity (PI) analysis.
- Experience with IC package design.
- Ability to optimize BGA and WLCSP layouts.
- Focus on manufacturability in design processes.
Required skills
- Cadence APD (or equivalent EDA software).
- Signal Integrity analysis.
- Power Integrity analysis.
- BGA layout optimization.
- WLCSP layout optimization.
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Published 1 month ago
Expires 3 weeks from now
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Advance Package Design
Karachi
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